Mini FPC/FFC to PCB Hot Bar Soldering Machine with Camera System
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x| Temperature Accuracy | ± 3 ℃ | Condition | New Original |
|---|---|---|---|
| Usage | Pulse Heat | Work Air Pressure | 0.5-0.7MPA |
| Air Pressure | 0.4-0.75MPa | Power | 110/220V |
| Power Consumption | 500W | Application | FFC/FPC To PCB, Wires To PCB |
A Mini Hot Bar Soldering Machine is a compact thermal bonding system used for precision soldering or thermo-compression bonding of electronic components. It uses a heated metal bar (hot bar) to apply heat and pressure to localized areas, enabling the bonding of flexible circuits (FPCs), ribbon cables, display panels (COF/COG), or wires to PCBs or glass substrates.
Designed for bench-top use, the mini hot bar machine is ideal for prototyping, low- to medium-volume production, or repair tasks where space-saving and precision are essential.
- Unique pulse heat technology provides fastest soldering head heating.
- Programmable soldering temperature, heat-up rate and time duration for a wide range of products.
- Thermocouple is fixed in close proximity to the working surface & the thermode, thus providing accurate temperature feedback control.
- Closed Loop PID temperature control with clearly visible LED display.
- Soldering time can be programmable and is triggered by temperature.
- Floating thermode ensures consistent pressure and heat transfer between the thermode head and the parts to be joined.
- Programmable pressure switch with LCD display for precise force control.
- CCD camera system with magnification lens can be retrofitted for fine-pitch positioning.
| Model | SMTS01 |
| Machine size | 590×640×620mm |
| Working area | Max 200*170mm |
| Machine weight | 62Kg |
| Working air pressure | 0.4-0.75Mpa |
| Power supply | AC220V±10% 50HZ,2200W |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Welding pressure | 1~20Kg |
| Temperature settings | RT~500℃ |
| Tolerance | ±3℃ |
| Pressing time | 1~99.9s |
| Welding precision | pitch 0.2mm |
| Fixture quantity | 1 |
| Alignment mode | CCD + LCD Monitor |
| Starting mode | Press start buttom |
| Feeding mode | Manual |
Pulse head bonding machine is used in the following commodity production technologies: USB cable welding, welding of flexible cable FFC and flexible circuit board FPC or hard circuit board PCB, welding between TCP and circuit board PCB or flexible circuit board FPC, welding between flexible circuit board FPC and circuit board PCB, etc.
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| Application Area | Details |
| FPC to PCB Soldering | Attaching flexible circuits in smartphones, tablets, and wearables. |
| LCD / OLED Display Bonding | Soldering COF (chip-on-film) or FOG (flex-on-glass) cables to display panels. |
| Ribbon Cable Termination | Joining flat cables to connectors or circuit boards. |
| Repair Work | Re-soldering connections in mobile devices, laptops, or small electronics. |
| Touch Panel Assembly | Thermocompression bonding of touch sensor flexes to controller boards. |
| Automotive Displays | Used in infotainment and dashboard electronics for bonding displays. |
| Medical Electronics | Assembling compact, high-reliability medical devices. |
| Battery Pack Assembly | Spot bonding of battery tabs or flexible sensors. |
