SMTSX XY Movable Universal Hot Bar Soldering Machine for High Productivity
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x| Temperature Accuracy | ± 3 ℃ | Condition | New Original |
|---|---|---|---|
| Usage | Pulse Heat | Work Air Pressure | 0.5-0.7MPA |
| Air Pressure | 0.4-0.75MPa | Power | 110/220V |
| Power Consumption | 500W | Application | FFC/FPC To PCB, Wires To PCB |
| Lcd | Set Program | Weight | 163 Kg |
| Delievery Time | Free For One Year | Warning Light | Ensure Operate Correctly |
| Temperature | 0~450℃ | Temperaturecontrol | Digital PID Controller |
| Testing Report | Provide | Tolerance Of Temp | +3°C |
| Visual Positioning System | ±0.003mm | Pin Distance Range | >0.2mm |
| Fixture | 1 Set |
Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated using a heating element (called a thermode or a Hot Bar) to a sufficient temperature to melt the solder. The parts are then cooled below the solidification temperature to form a permanent electro-mechanical bond.
- According to different products, optional temperature for your choice.
- Unique material thermode head, ensure the average pressure.
- Has vacuum function, easier for adjustment and positioning.
- NC temperature, clear and high precision.
- With digital pressure gauge, pressure range can be preset.
- Programmable curve Including pre-heating and reflow soldering temperature.
- Suitable for all kinds of high density TAB, TCP and pressure to FPC, FFC and PCB soldering pressure welding.
- Precise PID control, phase angle replace pulse drive.
- Less Libration, less noise, avoiding voltage fluctuate
| Model | SMTSX |
| Machine size | 680*650*600mm |
| Working area | 250x250mm |
| Machine weight | 163Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±3℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | 3-stage |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ, 2000W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start buttons |
| Rotation Platform | Cylinder control, tolerance<0.02mm |
Easy to use, robust and economical for bonding flex to rigid assemblies such as flex to PCB, FPC to FPC, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB, Wires to PCB.
This Hot Bar Soldering Machine offers a high-precision, high-volume solution for thermal bonding in electronics assembly.
| Application Area | Details |
| FPC to PCB Soldering | Attaching flexible circuits in smartphones, tablets, and wearables. |
| LCD / OLED Display Bonding | Soldering COF (chip-on-film) or FOG (flex-on-glass) cables to display panels. |
| Ribbon Cable Termination | Joining flat cables to connectors or circuit boards. |
| Repair Work | Re-soldering connections in mobile devices, laptops, or small electronics. |
| Touch Panel Assembly | Thermocompression bonding of touch sensor flexes to controller boards. |
| Automotive Displays | Used in infotainment and dashboard electronics for bonding displays. |
| Medical Electronics | Assembling compact, high-reliability medical devices. |
| Battery Pack Assembly | Spot bonding of battery tabs or flexible sensors. |
